Huawei Consumer Business Group has launched its latest System-on-Chip (SoC) for mobile devices at IFA 2017 in Berlin, the Kirin 970. The company announced that with the launch of Kirin 970, it is focusing on ‘the future of artificial intelligence’.
Kirin 970 is the first SoC by Huawei to pack a dedicated Neural Processing Unit (NPU) meant for ‘native AI processing’.
By combining cloud technology with native AI processing, Huawei aims to bring AI experiences to life and change the way we interact with our devices.
“The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition”, said Richard Yu, CEO of Huawei Consumer Business Group.
Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one cm². Huawei’s flagship Kirin 970 mobile AI computing platform features a dedicated Neural Processing Unit (NPU).
According to Huawei, compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970’s new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, Huawei also said.